HDI custom PCB is widely used to reduce the weight and overall dimensions of products, as well as enhancing the electrical performance of the device. It's regularly found in mobile phones, touch-screen devices, and 4G network communications.
PCBZOOoffers HDI custom PCB fabrication with microvias down to 4 mil; laser drilling is required.
|HDI Structures||Type of micorovias||Mass production||Middle/small batch||Prototype||Apply to|
|1+N+1||Blind vias||Yes||Yes||Yes||4 layers+|
|2+N+2||Blind/Buried staggered vias||Yes||Yes||Yes||6 layers+|
|2+N+2||Blind/Buried stacked vias||Yes||Yes||Yes||6 layers+|
|3+N+3||Blind/Buried staggered vias||/||Yes||Yes||8 layers+|
|3+N+3||Blind/Buried stacked vias||/||/||Yes||8 layers+|
Electronic design in the continuous improvement of the performance of the same time, but also in efforts to reduce its size. From mobile phones to smart weapons of small portable products, the "small" is always the same pursuit. High density integration (HDI) technology can make the end product design more compact, while meeting the higher standard of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (photo) camera, MP3, MP4, notebook computers, automotive electronics and other digital products, which is the most widely used mobile phone applications. The HDI board generally uses the lamination (Build-up) manufacturing, the more the number of layers, the higher the grade plate. HDI ordinary board basically is the 1 layer of high order HDI with 2 or more layer technology, at the same time using laminated holes, electroplating hole filling, direct laser drilling and other advanced technology PCB. High order HDI board is mainly used in 3G mobile phones, advanced digital video camera, IC board, etc.
Based on high order of HDI board USES - 3 g board or IC loading board, its future is growing so quickly, in the next few years the world 3 g mobile phone growth to exceed 30%, China is about to issue 3 g licences; IC loading board industry consultancy Prismark prediction to China from 2005 to 2010 growth rate of 80%, it represents the PCB technology development direction.